EPIC: A Cost-Effective Plastic Chip Carrier for VLSI Packaging

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 8, Issue 3, 1985, Pages 386-390

  Sinnadurai, Nihal ^a,b  

^a BRITISH TELECOM   (United Kingdom)

^b BPA ^*  (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING - COSTS; PLASTICS - BONDING; PRINTED CIRCUITS - COMPONENTS;

EPIC PLASTIC CHIP CARRIER (CC); SMALL OUTLINE (SO) PLASTIC MICROPACKAGES; SURFACE-MOUNTED ASSEMBLY;

INTEGRATED CIRCUITS, VLSI;

EID: 0022126750     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCHMT.1985.1136511     Document Type: Article

References (5)

1. Handbook of Microelectronics Packaging and Interconnection Technologies, F. N. Sinnadurai, Ed. Electrochemical Publications, 1985.
2. F. N. Sinnadurai, “An evaluation of plastic coatings for high reliability microcircuits,” Microelectronics J., vol. 12, pp. 30–38, 1981.
3. F. N. Sinnadurai and D. J. Small, “The manufacture and reliability of the EPIC chip carrier,” presented at Proc. Printed Circuit World Convention, Washington, DC, May, 1984.
4. N. Sinnadurai and D. Roberts, “Assessments of micropackaged integrated circuits for high reliability applications,” in Proc. ISHM Int. Microelectronics Symp., pp. 432–443, 1982.
5. M. L. White, J. W. Serpiello, K. M. String, and W. Rosenzweig, “The use of silicone RTV rubber for alpha particle protection on silicon integrated circuits,” in Proc. IEEE IRPS, pp. 43–47, 1981.