Structural Effects on a Submicron Trench Process

Journal of the Electrochemical Society

Volumn 132, Issue 7, 1985, Pages 1705-1707

  Chin, Daeje ^a   Dhong, Sang H ^a   Long, Glenn J ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DATA STORAGE, DIGITAL; IONS - ETCHING;

MEMORIES; STRUCTURAL EFFECTS; SUBMICRON TRENCH PROCESS; WAFERS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0022092551     PISSN: 00134651     EISSN: 19457111     Source Type: Journal    
DOI: 10.1149/1.2114195     Document Type: Article

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