Analysis of Multilayer Interconnection Lines for a High-Speed Digital Integrated Circuit

IEEE Transactions on Microwave Theory and Techniques

Volumn 33, Issue 6, 1985, Pages 527-532

  Fukuoka, Yoshiro ^a   Zhang, Qui ^b   Neikirk, Dean P ^b   Itoh, Tatsuo ^b  

^a Uniden Satellite Technology Inc ^*  (Japan)

^b UNIVERSITY OF TEXAS AT AUSTIN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC WIRING;

COUPLING PHENOMENA AMONG ADJACENT LINES; FREQUENCY DISPERSION; INPUT AND OUTPUT IMPEDANCE; MULTILAYER INTERCONNECTION LINES; TRANSMISSION LINE PARAMETERS;

INTEGRATED CIRCUITS, DIGITAL;

EID: 0022079941     PISSN: 00189480     EISSN: 15579670     Source Type: Journal    
DOI: 10.1109/TMTT.1985.1133109     Document Type: Article

References (8)

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