Plating Process for the High Speed Deposition of Palladium for Contact Devices.;GALVANISIERVERFAHREN ZUR HOCHGESCHWINDIGKEITSABSCHEIDUNG VON PALLADIUM FUER KONTAKTBAUTEILE.

Siemens Forschungs- und Entwicklungsberichte/Siemens Research and Development Reports

Volumn 14, Issue 3, 1985, Pages 140-146

  Vanhumbeeck, Jacky ^a  

^a Fertigungsaufgaben Oostkamp Belg ^*

Author keywords

[No Author keywords available]

Indexed keywords

AMMONIA; ELECTRIC CONTACTORS - ELECTROPLATING; ELECTRIC CONTACTS - ELECTROPLATING; ELECTROLYTES; PHOSPHATES;

BUFFER; CONTACT DEVICES; HIGH SPEED DEPOSITION OF PALLADIUM; PALLADIUM CHLORIDE; PALLADIUM PLATING PROCESS;

PLATINUM AND ALLOYS;

EID: 0021834577     PISSN: 03709736     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)