Gold-Aluminum Intermetallics: Ball Bond Shear Testing and Thin Film Reaction Couples

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 7, Issue 4, 1984, Pages 349-356

  Clatterbaugh, Guy V ^a   Weiner, Joel A ^a   Charles, Harry K ^a  

^a JOHNS HOPKINS UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUIT TESTING; INTERMETALLICS; SOLDERING - FAILURE;

BALL-BOND SHEAR TESTING; GOLD-ALUMINUM INTERMETALLICS; THIN-FILM REACTION COUPLES;

INTEGRATED CIRCUITS;

EID: 0021658081     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCHMT.1984.1136367     Document Type: Article

References (10)

1. H. K. Charles, Jr. and G. V. Clatterbaugh, “Ball bond shearing—A complement to the wire bond pull test,” in Proc. Int. Microelectronics Symp., Nov. 1983, pp. 171–186.
2. M. L. White, J. W. Jierpiello, K. M. Striny, and W. Rosenzweig, “The use of silicone RTV rubber for alpha particle protection on silicon integrated circuits,” in 19th Annu. Proc., Reliability Physics, 1981, pp. 43–47.
3. W. Shimade, T. Kondo, H. Sakane, T. Banjo, and K. Nakagawa, “Thermo-compression bonding of Au-Al system in semiconductor IC Assembly Process,” in Proc. Int. Conf. Soldering, Brazing and Welding in Electronics, DVS, Munich, Nov. 1976, pp. 127–132.
4. J. A. Weiner, G. V Clatterbaugh, H. K. Charles, Jr., and B. M. Romenesko, “Gold ball bond shear strength—Effects of cleaning, metallization and bonding parameters,” in Proc. 33rd Electronics Components Conf., May 1983, p. 208.
5. M. H. Francombe, A. J. Noreika, and W. J. Takei, Thin Solid Films, vol. 1, p. 353, 1967.
6. D. P. Koleshikov, A. F. Andrushko, and Y. E. I. Sukhinina, Fizika Metall, vol. 34, p. 529, 1972.
7. G. Majni, C. Wobili, G. Ottaviani, and M. Costato, “Gold-aluminum thin-film interactions and compound foundation,” J. Appl. Phys., vol. 52, no. 6, pp. 4047–054, June 1981.
8. E. Philofsky, “Purple plaque revisited,” Solid-State Electronics, vol. 13, no. 10, pp. 1391–1.399, Oct. 1970.
9. W. J. Takei and M. H. Francombe, “Measurement of diffusion-induced strains at metal bond interfaces,” Solid-State Electronics, vol. 11, pp. 205–208, 1968.
10. H. K. Charles, Jr., G. V. Clatterbaugh, and J. A. Weiner, “The ball bond shear test,” Semiconductor Processing, ASTM STP 850, Dinesh C. Gupta, Ed., American Society for Testing and Materials, 1984 (to appear).