Copper/Polyimide Materials System for High Performance Packaging

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 7, Issue 4, 1984, Pages 384-393

  Jensen, Ronald J ^a   Cummings, John P ^b   Vora, Harshadrai ^a,c  

^a HONEYWELL   (United States)

^b HONEYWELL TECHNOLOGY CENTER   (United States)

^c Unisys   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER AND ALLOYS; POLYIMIDES; STRESSES - MEASUREMENTS;

COPPER/POLYIMIDE MATERIALS; MULTILAYER INTERCONNECTIONS;

INTEGRATED CIRCUITS, THIN FILM;

EID: 0021651243     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCHMT.1984.1136378     Document Type: Article

References (19)

1. J. R. Bupp, L. N. Challis, R. E. Ruane, and J. P. Wiley, “High-density board fabrication techniques,” IBM J. Res. Dev., vol. 10, pp. 306–317, May 1982.
2. A. J. Bodgett, Jr., “A multilayer ceramic, multichip module,” in Proc. Electronic Components Conf., 1980, pp. 283–285.
3. C. W. Ho, D. A. Chance, C. H. Bajorek, and R. E. Acosta, “The thin film module as a high-performance semiconductor package,” IBM J. Res. Dev., vol. 26, pp. 286–296, May 1982.
4. D. E. Pitkanen, J. P. Cummings, and C. J. Speerschneider, “Status of copper thick film hybrids,” Solid State Technology, pp. 141–146, Oct. 1980.
5. S. LeBow, “A method of manufacturing high density fine line printed circuit multilayer substrates which can be thermally conductive,” in Proc. Electronic Components Conf., 1980, pp. 307–309.
6. N. Goldberg, “Design of thin film multichip modules,” in Proc. Int. Soc. Hybrid Microelec., vol. 4, 1981, pp. 289–295.
7. M. E. Ecker and L. T. Olson, “Chip carriers for high density semiconductor dies,” in Proc. Int. Soc. Hybrid Microelec., vol. 4, 1981, pp. 251–257.
8. J. Shurboff, “Polyimide dielectric on hybrid multilayer substrates,” Proc. Electronic Components Conf., 1983, pp. 610–615.
9. J. P. Cummings, R. J. Jensen, D. J. Kompelien, and T. J. Moravec, “Technology base for high performance packaging,” in Proc. Electronic Components Conf., 1982, pp. 465–478.
10. R. P. Vidano, J. P. Cummings, R. J. Jensen, W. L. Walters, and M. J. Helix, “Technology and design for high speed digital components in advanced applications,” in Proc. Electronic Components Conf., 1983, pp. 334–343.
11. D. Pelzer, “Wafer scale integration: The limits of VLSI?,” VLSI Design, pp. 43–47, Sept. 1983.
12. E. E. Davidson, “Electrical design of a high speed computer package,” IBM J. Res. Dev., vol. 26, pp. 349–361, May 1982.
13. C. H. McIver, “Flip TAB, copper thick film create the micropackage,” Electronics, vol. 55, pp. 90–99, Nov. 1982.
14. S. MN. Zalar, “Dielectric characterization of polyimide thin films,” in Extended Abstracts of First Technical Conf. Polyimides, 1982, pp. 143–144.
15. A. M. Wilson, “Polyimide insulators for multilevel interconnections,” Thin Solid Films, vol. 83, pp. 145–163, 1981.
16. L. B. Rothman, “Properties of thin polyimide films,” J. Electrochem. Soc., vol. 127, pp. 2216–2220, Oct. 1980.
17. C. Goldsmith, P. Geldermans, F. Bedetti, and G. A. Walker, “Measurements of stress generated in cured polyimide films,” J. Vac. Sci. Technol., vol. Al, pp. 407–409, Apr.–June 1983.
18. DuPont Technical Information Bulletin, “Kapton-Summary of Properties,” No. E-50553, Aug. 1982.
19. L. I. Maissel and R. Glang, Handbook of Thin Film Technology. New York: McGraw Hill, 1970, ch. 12, pp. 22–23.