Narrow Channel Forced Air Heat Sink

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 7, Issue 1, 1984, Pages 154-159

  Goldberg, Norman ^a  

^a Unisys   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUITS, VLSI - HEAT SINKS;

FORCED AIR HEAT SINKS;

HEAT SINKS;

EID: 0021386376     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCHMT.1984.1136326     Document Type: Article

References (6)

1. T. S. Steele, “Terminal and cooling requirements for LSI packages,” IEEE Trans. Components, Hybrids, Manufact. Technol., vol. CHMT-4, no. 2, pp. 187–191, June 1981.
2. S. Oktay and H. C. Kammerer, “A conduction-cooled module for high performance LSI devices,” IBM J. Res. Develop., vol. 26, no. 1, pp. 55–60,Jan. 1982.
3. D. B. Tuckerman and R. F. W. Pease, “High performance heat sinking for VLSI,” IEEE Electron Dev. Letters, vol. EDL-2, no. 5, pp. 126–129, May 1981.
4. W. M. Kays, Convective Heat and Mass Transfer. New York: McGraw-Hill, 1958.
5. M. Necate Ozisik, Basic Heat Transfer. New York: McGraw-Hill, 1977.
6. J. G. Knudson and D. L. Katz, Fluid Dynamics and Heat Transfer. New York: McGraw-Hill, 1958.