STRAIN MEASUREMENTS DURING THERMAL CHAMBER CYCLING OF LEADLESS CERAMIC CHIP CARRIERS SOLDERED TO PRINTED BOARDS.

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1984, Pages 107-116

  Hall, P M ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC CHIP CARRIER CONNECTIONS; COPPER-CLAD-INVAR LAYER; PRINTED CIRCUIT BOARDS; SOLDER JOINTS; STRAIN GAGE MEASUREMENTS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0021183865     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)