APPRAISAL OF HIGH TEMPERATURE HUMIDITY STRESS TESTS FOR ASSESSING PLASTIC ENCAPSULATED SEMICONDUCTOR COMPONENTS.

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 1983, Pages 73-82

  Merrett, Robert P ^a   Bryant, James P ^a   Studd, Raymond ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

ASSESSING PLASTIC ENCAPSULATED SEMICONDUCTOR COMPONENTS; FAILURE ANALYSIS; HIGH TEMPERATURE HUMIDITY STRESS TESTS; LIFE TESTS; STORAGE TESTS;

SEMICONDUCTOR DEVICES, MOS;

EID: 0020942743     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)