More than a decade of the non-saturating autoclave as a highly accelerated stress technique for evaluating the reliability of nonhermetic microelectronic components

Microelectronics Reliability

Volumn 23, Issue 5, 1983, Pages 833-836

  Sinnadurai, N ^a  

^a British Telecom Research Laboratories Martlesham Heath Ipswich IP5 7RE UK ^*

Author keywords

[No Author keywords available]

Indexed keywords

HUMID ENVIRONMENTAL TESTING; NON-SATURATING AUTOCLAVE TECHNIQUE;

INTEGRATED CIRCUITS;

EID: 0020941357     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/0026-2714(83)91007-7     Document Type: Article

References (15)

1. Plastics for long life microcircuit encapsulation, Part 1: materials properties and possible failure mechanisms
2. The design and evaluation of reliable plastic encapsulated devices
3. Plastics for long life microcircuit encapsulation, Part 2: water absorption and resin-to-lead adhesion
4. The accelerated ageing of plastic encapsulated semiconductor devices in environments containing a high vapour pressure of water
5. Evaluation of MOD specification for procurement of plastic encapsulated semiconductor devices
6. Highly accelerated temperature and humidity stress test technique (HAST)
7. Temperature-humidity acceleration of metal-electrolysis failure in semiconductor devices
8. The accelerated testing of plastic encapsulated semiconductor components
9. The influence of plastic encapsulants and passivation layers on the corrosion of thin aluminium films subjected to humidity stress
10. The ageing behaviour of commercial thick film resistors
11. New acceleration factors for temperature humidity bias testing
12. An evaluation of plastic coatings for high reliability microcircuits
13. Assessments of micro-packaged integrated circuits for hybrids for high reliability applications