PLASTIC ENCAPSULATION OF ACTIVE DEVICES ON HYBRID MICROCIRCUITS.

Proceedings - European Hybrid Microelectronics Conference

Volumn , Issue , 1983, Pages 122-132

  Boyer, S M ^a  

^a Standard Telecommunication Laboratories Ltd   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE DEVICES; BOND WIRE LIFETIMES; ENVIRONMENTAL PROTECTION; HYBRID MICROCIRCUITS; PLASTIC ENCAPSULATION; WIRE BONDED SEMICONDUCTOR DEVICES;

INTEGRATED CIRCUITS, HYBRID;

EID: 0020918487     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)