Reactive Ion Etching of Copper Films

Journal of the Electrochemical Society

Volumn 130, Issue 8, 1983, Pages 1777-1779

  Schwartz, G C ^a   Schaible, P M ^a  

^a IBM   (United States)

Author keywords

CCl4 plasma; chlorinated plasma; copper film; reactive ion etch (RIE)

Indexed keywords

ETCHING;

REACTIVE ION ETCH;

COPPER AND ALLOYS;

EID: 0020798739     PISSN: 00134651     EISSN: 19457111     Source Type: Journal    
DOI: 10.1149/1.2120092     Document Type: Article

References (2)

1. P. M. Schaible, W. C. Metzger, and J. P. Anderson, J. Vac. Sci. Technol., 15, 334, (1978)
2. J. L. Mauer, J. S. Logan, L. B. Zielinski, and G. C. Schwartz, J. Vac. Sci. Technol., 15, 1734, (1978)