Extraneous Metal Deposits from Production Processes on Contact Materials

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 6, Issue 1, 1983, Pages 55-60

  Haque, C A ^a   Drozdowicz, Michael H ^a   Frank, Ronald A ^a   Hanlon, James T ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT RESISTANCE;

ELECTRIC CONTACTS;

EID: 0020719421     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCHMT.1983.1136153     Document Type: Article

References (9)

1. T. F. Egan, “Contamination during manufacture of low energy electrical contacts,” in Proc. Holm Conf. on Electrical Contacts, 1968, p. 267.
2. G. Tissier, C. Le Gressus, and J. Bouygues, “Surface phenomena in electronics interconnection technology: A review,” in Proc. Holm Conf. on Electrical Contacts, 1981, p. 175.
3. F. E. Bader, “A new inlay contact material for Bell System connectors,” in Proc. 11th Int. Conf. on Elec. Contact Phenomena, June 1982, p. 133.
4. S. P. Sharma, E. S. Sproles, and F. E. Bader, “Characterization of inlay materials,” in Proc. 32nd Electronic Components Conf., May 1982, p. 51.
5. C. A. Haque, “Copper on gold contact tape,” Bell Laboratories internal publication.
6. S. K. Sen, S. Sen, and C. L. Bauer, “Determination of the oxidation states of tin by-Auger electron spectroscopy,” Thin Solid Films, vol. 82, p. 157, 1981.
7. Handbook of Chemistry and Physics, 61st ed. Boca Raton, FL: CRC Press, 1980–81, pp. D-70 and D-77.
8. M. Antler, M. H. Drozdowicz, and C. A. Haque, “Connector contact materials: Effect of environment on clad palladium, palladium-silver alloys, and gold electrodeposits,” IEEE, Trans. Components, Hybrid, Manuf. Technol., vol. CHMT-4, p. 482, Dec. 1981.
9. Metals Handbook, vol. 1, 8th ed. Metals Park, OH: American Soc. Metals, 1961, pp. 1193–1195.