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Thin Solid Films

Volumn 101, Issue 3, 1983, Pages 207-218

Low temperature interdiffusion in Cu/Ni thin films

(3) Lefakis, H a Cain, J F a Ho, P S b

a IBM (United States)

b IBM T J WATSON RESEARCH CENTER (United States)

Author keywords

[No Author keywords available]

Indexed keywords

NICKEL AND ALLOYS - THIN FILMS; SPECTROSCOPY, AUGER ELECTRON;

INTERDIFFUSION;

COPPER AND ALLOYS;

EID: 0020719347 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/0040-6090(83)90247-X Document Type: Article

Times cited : (34)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.