THERMAL DEFORMATIONS OBSERVED IN LEADLESS CERAMIC CHIP CARRIERS SURFACE MOUNTED TO PRINTED WIRING BOARDS.

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1983, Pages 350-359

  Hall, P M ^a   Dudderar, T D ^a   Argyle, J F ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION ANGLES DURING THERMAL CHAMBER CYCLING; DEFORMATION MODES FOR A SOLDER POST; EXPANSIONS DUE TO POWER DISSIPATION IN CHIP CARRIER; HOLOGRAPHIC INTERFEROGRAMS; INTERFEROMETER TEST PROGRAM; THERMAL CHAMBER CYCLING;

PRINTED CIRCUITS;

EID: 0020499840     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)