QUALITY OF DIE-ATTACHMENT AND ITS RELATIONSHIPS TO STRESSES AND VERTICAL DIE-CRACKING.

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1983, Pages 237-244

  van Kessel, C G M ^a   Gee, S A ^a   Murphy, J J ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

AMOUNT OF STRESS RELAXATION; FRACTURE CRITERION; RESIDUAL STRESSES AFTER DIE ATTACHMENT; STUDY BY DIFFUSED RESISTOR STRAIN GAGES; TWO DIMENSIONAL DISTRIBUTIONS OF STRESSES; VARIOUS METHODS OF DIE ATTACHMENT;

INTEGRATED CIRCUITS;

EID: 0020498208     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)