EPOXIDE RESINS FOR USE AT LOW TEMPERATURES.

Nonmetallic Materials and Composites at Low Temperatures

Volumn , Issue , 1982, Pages 73-87

  Evans, D ^a   Morgan, J T ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

COOL DOWN FROM ROOM TEMPERATURE; CURED RESIN SYSTEMS; FORMULATION VARIABLES; IMPROVED RESISTANCE TO THERMAL SHOCK; LOW TEMPERATURE PHYSICAL PROPERTIES; UNFILLED EPOXIDE RESIN SYSTEMS;

EPOXY RESINS;

EID: 0020288662     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1007/978-1-4613-3365-4_6     Document Type: Conference Paper

References (0)