Residual stress and thermal expansion coefficient of plasma polymerized films

Journal of Applied Polymer Science

Volumn 27, Issue 6, 1982, Pages 2139-2150

  Morinaka, Akira ^a   Asano, Yoshihiro ^a  

^a NTT CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT TREATMENT - ANNEALING; MONOMERS - CHEMISTRY; PLASMAS - APPLICATIONS; PLASTICS FILMS - THERMAL PROPERTIES; STRESSES;

RESIDUAL STRESSES; THERMAL EXPANSION;

POLYMERIZATION;

EID: 0020140274     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.1982.070270625     Document Type: Article

References (14)

1. Young's Modulus, Shear Modulus, and Poisson's Ratio in Silicon and Germanium