The effect of passivation thickness on the electromigration lifetime of Al/Cu thin film conductors

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 1, Issue 2, 1983, Pages 455-458

  Lloyd, J R ^a   Smith, P M ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM AND ALLOYS; COPPER AND ALLOYS; ELECTRIC CONDUCTORS;

INTEGRATED CIRCUITS, THIN FILM;

EID: 0020115364     PISSN: 07342101     EISSN: 15208559     Source Type: Journal    
DOI: 10.1116/1.571946     Document Type: Article

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