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Volumn , Issue , 1981, Pages 283-302
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OPPORTUNITIES FOR THERMAL OPTIMIZATION IN ELECTRONICS PACKAGING.
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Author keywords
[No Author keywords available]
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Indexed keywords
MILITARY ELECTRONICS;
THERMAL MANAGEMENT;
THERMAL STRESSES;
ELECTRONICS PACKAGING;
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EID: 0019708261
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (3)
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References (0)
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