Coupling Capacitances for Two-Dimensional Wires

IEEE Electron Device Letters

Volumn 2, Issue 8, 1981, Pages 196-197

  Dang, R L M ^a   Shigyo, N ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUITS;

EID: 0019603042     PISSN: 07413106     EISSN: 15580563     Source Type: Journal    
DOI: 10.1109/EDL.1981.25399     Document Type: Article

References (7)

1. A. E. Ruehli, IBM J. Res. Develop., vol. 23, no. 6, p. 626, Nov. 1979.
2. A. E. Ruehli and P. A. Brennan, IEEE J.Solid-State Circuits, vol. SC-10, no. 6, p. 530, Dec. 1975.
3. J. W. Duncan, Trans. on Microwave Theory and Technique, vol. MTT-15, no. 10, p. 575, Oct. 1967.
4. W. H. Chang, IEEE Trans. on Microwave Theory and Technique, vol. MTT-24, no. 9, p. 608, Sept. 1976 and vol. MTT-25, no. 8, p. 712, Aug. 1977.
5. A. E. Ruehli and P. A. Brennan, IEEE J.Solid-State Circuits, vol. SC-8, no. 8, p. 289, Aug. 1973.
6. J. G. Poksheva, D. N. Pattanayak, and J. H. Nelson, Device Research Conference (sponsored by the IEEE Electron Devices Society), p. VA-7, June 23–25, 1980.
7. T. Shibata et al., Proceedings of the Electrochemical Society Meeting, Minneapolis, Minnesota, May 1981.