Effect of texture and grain structure on electromigration in Al-0.5%Cu thin films

Thin Solid Films

Volumn 75, Issue 3, 1981, Pages 253-259

  Vaidya, S ^a   Sinha, A K ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTALS - MICROSTRUCTURE;

ELECTROMIGRATION;

ALUMINUM COPPER ALLOYS;

EID: 0019487986     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/0040-6090(81)90404-1     Document Type: Article

References (12)

1. Electromigration and failure in electronics: An introduction
2. Electrochemical Society Spring Meet., Extended Abstracts