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Volumn STP 674, Issue , 1979, Pages 282-288
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Viscoelastic Parameters of Epoxy Resin from Thermomechanical and Electrical Conductivity Measurements
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Author keywords
composite materials; creep compliance; epoxy resins; time temperature superposition; viscoelasticity
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Indexed keywords
CREEP;
ELECTRIC CONDUCTIVITY;
GLASS CERAMICS;
VISCOELASTICITY;
COMPOSITES MATERIAL;
CREEP COMPLIANCE;
DIRECT-CURRENT;
ELECTRICAL CONDUCTIVITY;
ELECTRICAL CONDUCTIVITY MEASUREMENTS;
THERMO-MECHANICAL;
TIME TEMPERATURE SUPERPOSITION;
TIME-TEMPERATURE;
UNIAXIAL CREEP;
VISCO-ELASTIC PARAMETERS;
EPOXY RESINS;
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EID: 0018720101
PISSN: 00660558
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1520/STP36914S Document Type: Conference Paper |
Times cited : (6)
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References (9)
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