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Volumn STP 674, Issue , 1979, Pages 282-288

Viscoelastic Parameters of Epoxy Resin from Thermomechanical and Electrical Conductivity Measurements

Author keywords

composite materials; creep compliance; epoxy resins; time temperature superposition; viscoelasticity

Indexed keywords

CREEP; ELECTRIC CONDUCTIVITY; GLASS CERAMICS; VISCOELASTICITY;

EID: 0018720101     PISSN: 00660558     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1520/STP36914S     Document Type: Conference Paper
Times cited : (6)

References (9)
  • 3
    • 15544371076 scopus 로고
    • Interscience Publishers, Inc., New York, Chapter 26
    • Rutgers, A. J., Physical Chemistry, Interscience Publishers, Inc., New York, 1954, Chapter 26.
    • (1954) Physical Chemistry
    • Rutgers, A.J.1
  • 5
  • 7
    • 85169915859 scopus 로고
    • Fatigue Behavior of Adhesively Bonded Joints
    • Report FZM-6627 Nov. for Contract F33615-76-C-5220
    • "Fatigue Behavior of Adhesively Bonded Joints," Quarterly Progress Report No. 1, General Dynamics Report FZM-6627 (Nov. 1976) for Contract F33615-76-C-5220.
    • (1976) Quarterly Progress Report No. 1, General Dynamics


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.