EFFECT OF COMPRESSIVE STRESS ON REACTION-DIFFUSION IN THE Cu-Si SYSTEM.

Trans Jpn Inst Met

Volumn 18, Issue 2, 1977, Pages 107-112

  Onishi, Masami ^a   Miura, Hirofumi ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

THERMAL DIFFUSION - SOLIDS;

COPPER SILICON ALLOYS;

EID: 0017458516     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (0)