Adhesion Measurement of Thin Films

ElectroComponent Science and Technology

Volumn 3, Issue 1, 1976, Pages 21-42

  Mittal, K L ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; METALS AND ALLOYS - THIN FILMS;

FILMS;

EID: 0016960919     PISSN: 03053091     EISSN: None     Source Type: Journal    
DOI: 10.1155/APEC.3.21     Document Type: Article

References (88)

1. A. W. Henderson, Adhesion in electronics, in Aspects of Adhesion, Vol. 5, D. J. Alner, Editor, pp. 86-104, CRC Press, Cleveland, Ohio, 1969.
2. C. Weaver, Adhesion of thin films, Proc. of the First International Conference on Vacuum Techniques, Namur, 2, 734-736 (1958), Pergamon Press, London, England, (1960).
3. C. Weaver, The adhesion of metal films to surfaces, Chem. Ind., 370-373, February 27, 1965.
4. D. Davies and J. A. Whittaker, Methods of testing the adhesion of metal coatings to metals, Metallurgical Reviews 12, 15-26 (1967).
5. D. G. Williams, The adhesion of vacuum-deposited films, A Technical Report from Dow Chemical U.S.A., Rocky Flats Division, P.O. Box 888, Golden, Colorado. Under U.S. Atomic Energy Commission Contract AT (29-1) -1106, RFP-1690, July 21, 1972, 17 pages.
6. T. R. Bullett and J. L. Prosser, The measurement of adhesion, Prog. Org. Coatings 1, 45-73 (1972).
7. D. S. Campbell, Mechanical properties of thin films, in Handbood of Thin Film Technology, L. I. Maissel and R. Glang, Editors, Chapter 12, McGraw Hill Book Company, N. Y., 1970.
8. K. L. Mittal, A critical appraisal of the methods for measuring adhesion of electrodeposited coatings, in Properties of Electrodeposits: Their Measurement and Significance, R. Sard, H. Leidheiser, Jr., and F. Ogburn, Editors, Chap. 17, pp. 273-306, The Electro-chemical Society, Princeton, N.J. (1975).
9. B. N. Chapman, Thin-film adhesion, J. Vac. Sci. Tech. 11 106-113 (1974).
10. C. Weaver, Adhesion of thin films, J. Vac. Sci. Tech. 12, 18-25 (1975).
11. G. Salomon, in Adhesion and Adhesives, Vol. 1, p. 3, R. Houwink and G. Salomon, Editors, Elsevier Publishing Co., New York, 1965.
12. R. J. Good, On the definition of adhesion, J. Adhesion, in press.
13. D. Taylor, Jr. and J. E. Rutzler, Jr., Adhesion using molecular models, Ind. Eng. Chem. 50, 928-934 (1958).
14. R. J Good Intermolecular and interatomic forces, in Treatise on Adhesion and Adhesives, Vol. 1, Chap. 2 pp. 9-68, R. L. Patrick, Editor, Marcel Dekker, Inc., New York, 1967.
15. W. A. Zisman, Relation of the equilibrium contact angle to liquid and solid constitution, in Advances in Chemistry Series No. 43, pp. 1-51, American Chemical Society, Washington, D.C., 1964.
16. K. L. Mittal, Surface chemical criteria for maximum adhesion and their testing against the published experimental adhesive strength values, in Adhesion Science and Technology, vol. 9A, pp. 129-168, L. H. Lee, Editor, Plenum Press, New York, 1975.
17. P. Benjamin and C. Weaver, Condensation energies for metals on glass and other substrates, Proc. Roy. Soc A252, 418-430 (1959).
18. B. N. Chapman, Adhesion of thin metallic films, in Aspects of Adhesion Vol. 6, pp. 43-54, D. J. Alner, Editor, CRC Press, Cleveland, Ohio, 1971
19. R. B. Belser and W. H. Hicklin, Simple rapid sputtering apparatus, Rev. Sci. Instrum. 27, 293-296 (1956).
20. R. B. Belser, Aging study of metal plating on quartz crystals, Report No. AD48261, Defense Document Center, Wash., D.C., 1954.
21. J. R. Frederick and K. C. Ludema, Adhesion of vapor-deposited aluminum to lime-soda glass, J. Appl. Phys. 35, 256-257 (1964).
22. R. L. Beno, An adhesion tester for evaporated metal films, U.S. Atomic Energy Commission Contract AT (29-1) -1106, R.F.P. -672, January 11, 1966.
23. Y. Chiang and S. W. Ing, Interface and adhesion studies on evaporated selenium on oxide surfaces, J. Vac. Sci. Tech. 6, 809-814 (1969).
24. L. E. Collins, J. G. Perkins and P. T. Stroud, Effect of ion bombardment on the adhesion of aluminum films on glass, Thin Solid Films-4, 41-45 (1969).
25. K. Kuwahara, T. Nakagawa and K. Kuramasu, Effect of ion-pump evacuation on the adhesion of evaporated thin films. Japanese Inst. Metals Trans. 12, 218-219 (1971).
26. M. J. Hardon and M. A. Wright, High vacuum adhesion test apparatus, Rev. Sci. Instrum. 40, 1017-1021 (1969).
27. R. Jacobsson and B. Kruse, Measurement of adhesion of thin evaporated films on glass substrates by means of direct pull off method, Thin Solid Films 15, 71-77 (1973).
28. S. D. Cramer, et al., Measuring electrodeposit adhesion, Metal Finishing, 45-50 (March 1970).
29. D. W. Butler, A simple film adhesion comparator, J. Phys. (E) Sci. Instrum. 8, 979-980 (1970).
30. D. W. Butler, C. T. H. Stoddart and P. R. Stuart, Some factors affecting the adhesion of thin metal films, in Aspects of Adhesion Vol. 6 pp. 53-63, D. J. Alner, Editor, CRC Press, Cleveland, Ohio, 1971.
31. C. T. H. Stoddart, D. R. Clarke and C. J. Robbie, Thin film adhesion: Effect of glow discharge on substrate, Adhesion 2, 270-278 (1970).
32. K. Wieckowski, Conductive thin films, Pr. Nauk. Inst. Technol. Electron Politekh Wroclaw No. 7, 7-16 (1972).
33. F. D. Hallworth, Bond testing of silver-plated engine bearings, Automotive and Aviation Ind. 95 (2), 30 (1946)
34. J. W. Beams, Production and use of high centrifugal fields, Science 120, 619-625 (1954).
35. J. W. Beams, J. Breazeale and W. L. Bart, Mechanical strength of thin films of metal, Phys. Rev. 100, 1657-1661 (1955).
36. J. W. Beams, Study of adhesion by the high-speed rotor technique, Tech. Proc. Amer. Electroplaters Soc. 43, 211-214 (1956).
37. W. H. Dancy, Jr., A solid state ultracentrifuge for adhesion testing of electrodeposits, Technical Report RE 701-138, April 1970, 58 pp. AD 752 460, available NTIS.
38. 1975 Guiness Book of World Records. Norris McWhirter and Ross McWhirter, Editors, p. 185, Bantam Books, New York, 1975.
39. W. H. Dancy, Jr. and A. Zavarella, Adhesion of chromium and other deposits to steel, Plating 52, 1009-1016 (1965).
40. V. M. Ponizovskii, Yu. G. Svetlov and G. V. Chirkov, Determination of adhesion of copper and nickel coatings on a steel base by means of large centrifugal fields, Zashch Metal 3(4), 515-517 (1967); Chemical Abstracts 68, 42493X (1967).
41. V. M. Ponizovskii and G. P. Spelkov, Determination of the strength of the adherence of chromium electroplate on steel by a high centrifugal field method, Zavod Lab. 40(1), 107-109 (1974); Chemical Abstracts 80, 127398t (1974).
42. A. M. Malloy, W. Soller and A. G. Roberts, Evaluation of adhesion of organic coatings by ultracentrifugal and other methods -Part l, Paint Oil & Chem. Rev., pp. 14-19, August 27, 1953.
43. H. Alter and W. Soller, Ultracentrifugal measurement of the adhesion of epoxy polymer, Ind. Eng. Chem. 50, 922-927 (1958).
44. R. L. Patrick, W. A. Vaughan and C. M. Doede, The ultracentrifuge as an Instrument for testing adhesion, J. Polymer Sci. 28, 11-16 (1958).
45. J. R. Huntsberger, Influence of selective adsorption on adhesion, Polymer Sci. 43, 581-582 (1960).
46. J. R. Huntsberger, Ultracentrifugal measurement of adhesion: some limitations, Official Digest 33, 635(1961).
47. V. M. Ponizovskii, et al., Determination of the adhesion of coatings to steel… centrifugal force, Lakokrasoch Mater. Ikh Primen No. 5, 52-54 (1972); Chemical Abstracts 78, 85996n (1973).
48. S. Moses and R. K. Witt, Evaluation of adhesion by ultrasonic vibrations, Ind. Eng. Chem. 41, 2334-2338 (1949).
49. S. Moses, The nature of adhesion, Ind. Eng. Chem. 41, 2338-2342 (1949).
50. R. Faure, A. Carlan, J. Crebassa, G. Desvousseaux and B. Robrieux, Modification de la structure des couches minus d’argent soumiser a des vibrations mechaniques – measure de l’adhesion, Thin Solid Films 9, 329-339 (1972).
51. J. Strong, Evaporated aluminum films for astronomical mirrors, Publ. A.S.P. 46, 18 (1934).
52. J. Strong, On the cleaning of surfaces, Rev. Sci. Instrum. 6, 97-98 (1935).
53. R. C. Willians and R. C. Backus, The electronmicrographic structure of shadow-cast films and surfaces, J. Appl. Phys. 20, 98, 106 (1949).
54. K. E. Haq, K. H. Behrndt and I. Kobin, Adhesion mechanism of gold-underlayer film combinations to oxide substrates, Vac. Sci. Tech. 6, 148-152 (1969).
55. D. M. Mattox and J. E. McDonald, Interface formation during thin film deposition, J. Appl. Phys. 34, 2493-2494 (1963).
56. R. C. Sundhal, Relationship between substrate surface chemistry and adhesion of thin films, J. Vac. Sci. Tech. 9, 181-185 (1972).
57. W. T. Chen and T. F. Flavin, Mechanics of film adhesion: elastic and elastic-plastic behavior, IBM Journal of R&D. 16, No. 3, 203-213 (1972).
58. N. M. Poley and H. L. Whitaker, Adhesion of chromium films to soda lime glass, J. Vac. Sci. Tech. 11, 114-118 (1974).
59. D. S. Lin, The adhesion of metal films to glass and magnesium oxide in tangential shear, Physics (D): Appl. Phys. 4, 1977-1990 (1971).
60. J. W. Dini, J. R. Helms and H. R. Johnson, Ring shear test for quantitatively measuring adhesion of metal deposits, Electroplating Metal Finish. 25, 5-11 (1972).
61. J. W. Dini and H. R Johnson, Ring shear adhesion tests various deposit – substrate combinations, Metal Finish. pp. 44-48 (Aug. 1974).
62. O.S. Heavens, Some factors influencing the adhesion of films produced by vacuum evaporation, J. Phys. Radium 11, 355-360 (1959).
63. O.S. Heavens and L. E. Collins, L’epitaxie dans les lames polycrystallines, J. Phys. Radium 13, 658-660 (1952).
64. C. Weaver and R. M. Hill, Adhesion of evaporated aluminum films, Phil. Mag. 3, 1402-1410 (1958).
65. P. Bepjamin and C. Weaver, Measurement of adhesion of thin films, Proc. Roy. Soc. 254A, 163-176 (1960).
66. P. Benjamin and C. Weaver, Adhesion of metal films to glass, Proc. Roy. Soc. 254A, 177-183 (1960).
67. P. Benjamin and C.Weaver, The adhesion of evaporated metal film on glass, Proc. Roy. Soc. 261 A, 516-531 (1961).
68. P. Benjamin and C. Weaver, The adhesion of metals to crystal faces, Proc. Roy. Soc. 274A, 267-273 (1963).
69. C. Weaver, Adhesion of high energy surfaces, in Adhesion Fundamentals and Practice, pp. 46-57, Maclaren & Sons Ltd., London, 1969.
70. C. Weaver and D. J. Parkinson, Diffusion in gold-aluminum, P7. Mag. 22, 377-389 (1970).
71. K. L. Chopra, Thin Film Phenomena, pp. 313-323, McGraw-Hill Book Company, N.Y., 1969.
72. D. W. Butler, C. T. H. Stoddart and P. R. Stuart, The stylus or scratch method for thin film adhesion measurement; some observations and comments, J. Physics (D): Appl. Phys. 3, 877-883 (1970).
73. Μ. M. Karnowsky and W. B. Estill, Scratch test for measuring adherence of thin films to oxide substrates, Rev. Sci. Instrum. 35, 1324-1326 (1964).
74. J. Hamersky, Feststellung optimaler Parameter bei Adhasionsmessungen unter Anwendung der Ritzmethode, Thin Solid Films 3, 263-267 (1969).
75. J. Oroshnik and W. K. Croll, Thin film adhesion testing by the scratch method, paper presented at the Surface Science Symposium of the New Mexico Section of the American Vacuum Society, held in Albuquerque, N.M., April 22, 1970.
76. A. T. English and P.A. Turner, Stability of conductor metallization in corrosive environments, Electronic Materials 1, 1-14 (1972).
77. O. Berendsohn, Quantitative adhesion tests of vacuum deposited thin films, Testing Evaluation 1, 139-143 (1973).
78. J. E. Greene, J. Woodhouse and M. Pestes, A technique for detecting critical loads in the scratch test for thin film adhesion, Rev. Set Instrum. 45, 747-749 (1974).
79. J. Ahn, personal communication, 1974.
80. E. Hoffman and O. Geogoussis, Measurement of adhesion of paint films, J. Oil Color. Chem. Assoc. 42, 267-269 (1959).
81. H. Dannenberg, Measurement of adhesion by a blister method, J. Appl. Polymer Sei. 5, 125-134 (1961).
82. M. L. Williams, The continuum interpretation for fracture and adhesion, Appl. Polymer Set 13, 29- (1969).
83. L. Holland, Vacuum Deposition of Thin Films, pp. 88-103, Chapman & Hall Ltd., London, 1956.
84. F. Schossberger and K. D. Franson, Adhesion of evaporated metal films, Vacuum 9, 28-35 (1959).
85. E. Calvet and H. Prat, Recent advances in Microcalorimetry, Pergamon Press, N.Y., 1963.
86. B. N. Chapman, The adhesion of thin films, Ph.D. Thesis Electrical Eng. Dept. Imperial College, London, 1969.
87. M. M. Nekrasov, U.S.S.R. Patent 127063.
88. N. C. Anderson and A. Goodman, A technique for measuring the adhesion of thin films and the dynamic tensile strength of bonds, with commercial applications, Technical Report Published from Sandia Laboratories, Albuquerque, New Mexico, March 1972, 7 pages. The Report is available from NTIS under number SC-DR-69 320.