Effect of trace additions Cd, In and Sn on the interfacial structure and kinetics of growth of θ′ plates in AlCu alloy

Materials Science and Engineering

Volumn 14, Issue 3, 1974, Pages 271-279

  Sankaran, R ^a   Laird, C ^a  

^a UNIVERSITY OF PENNSYLVANIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COPPER ALLOYS;

EID: 0016071347     PISSN: 00255416     EISSN: None     Source Type: Journal    
DOI: 10.1016/0025-5416(74)90108-6     Document Type: Article

References (23)

1. Binding Energy between a Vacancy and an Atom of Third Element and their Effects on the Initial Ageing of Al-10 wt%Zn Alloys
2. Precipitation in Aluminium-Copper Alloys Containing Additions of Indium and Tin
3. The interaction between indium atoms and vacancies in dilute aluminium-indium alloys
4. The growth of faceted precipitates
5. Lateral Growth in Solid-Solid Phase Transformations