The origins of stress in thin nickel films

Thin Solid Films

Volumn 12, Issue 1, 1972, Pages 71-74

  Doljack, F A ^a   Hoffman, R W ^a  

^a CASE WESTERN RESERVE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FILMS - STRESSES; STRESSES;

NICKEL AND ALLOYS;

EID: 0015396543     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/0040-6090(72)90396-3     Document Type: Article

References (5)

1. Interdiffusion in Cu-Ni, Co-Ni, and Co-Cu
2. Low Temperature Diffusion in Polycrystalline Thin-Film Gold–Nickel Couples