The Contribution of Grain-Boundary Diffusion to Creep at Low Stresses

Metal Science Journal

Volumn 4, Issue 1, 1970, Pages 215-218

  Burton, B ^a   Greenwood, G W ^b  

^a UNIVERSITY OF BIRMINGHAM   (United Kingdom)

^b UNIVERSITY OF SHEFFIELD   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

METALS TESTING, CREEP; WIRE, COPPER;

COPPER AND ALLOYS--CREEP;

EID: 0014882504     PISSN: 00260681     EISSN: None     Source Type: Journal    
DOI: 10.1179/msc.1970.4.1.215     Document Type: Article

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