Computer-Aided Thermal Analysis of Power Semiconductor Devices

IEEE Transactions on Electron Devices

Volumn 17, Issue 9, 1970, Pages 765-770

  Wenthen, Fred T ^a  

^a GENERAL ELECTRIC COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER-AIDED THERMAL ANALYSI; COMPUTERS; D T; IETDA; SEMICONDUCTOR DEVICES;

EID: 0014839651     PISSN: 00189383     EISSN: 15579646     Source Type: Journal    
DOI: 10.1109/T-ED.1970.17071     Document Type: Article

References (6)

1. H. S. Carslaw and J. C. Jaeger, Conduction of Heat in Solids. Oxford, England: Clarendon, 1959.
2. G. Liebmann, “The solution of transient heat flow and heat transfer problems by relaxation,” Brit. J. Appl. Phys., vol. 6, pp. 129–135, 1955.
3. G. M. Dusinberre, Heat-Transfer Calculations by Finite Differ ences. Scranton, Pa.: International Textbook Co., 1961.
4. J. T. Anderson and J. M. Botje, “Spatial truncation error analy sis,” presented at the 1962 ASME-AIChE Heat Transfer Con ference (Houston, Tex.), August 1962 (ASME paper 62-HT-27).
5. A. Kardas, “Errors in a finite-difference solution of the heat flow equation,” Trans. ASME, Series C (Journal of Heat Transfer), vol. 86, pp. 561–562, 1964.
6. J. Watson, “Technical computations state-of-the-art,” General Electric Company, TIS Rept. 68-G-021, December 1968.