Molecular dynamics simulation of heat conduction and thermal stress in relation with continuum mechanics

Materials Science Research International

Volumn 4, Issue 1, 1998, Pages 45-52

  Uehara, Takuya ^a   Inoue, Tatsuo ^a  

^a KYOTO UNIVERSITY   (Japan)

Author keywords

Fourier number; Fourier's law; Heat conduction; Materio thermo mechanics; Melting; Molecular dynamics; Thermal stress

Indexed keywords

EID: 0013562158     PISSN: 13411683     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (11)

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