Effect of electric field annealing on the recrystallization and recrystallization textures of cold-rolled commercial pure copper

Jinshu Xuebao/Acta Metallurgica Sinica

Volumn 36, Issue 2, 2000, Pages 126-130

  Wang, Yinong ^a   He, Changshu ^a   Zhao, Xiang ^a   Zuo, Liang ^a   Zhi, Qizheng ^a   Liang, Zhide ^a  

^a NORTHEASTERN UNIVERSITY   (China)

Author keywords

Cold rolled copper; Electric field annealing; Recrystallization; Texture

Indexed keywords

EID: 0012695050     PISSN: 04121961     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (16)

1. Conrad H, Cao W D, Lu X P, Sprecher A F. Scr Metall Mater, 1989; 23: 697
2. Cao W D, Lu X P, Sprecher A F, Conrad H. Mater Sci Eng, 1990; A129: 157
3. Conrad H, Sprecher A F, Cao W D, Lu X P. JOM, 1990; 9: 28
4. Li Q M, Wu S C. Scr Metall Mater, 1994; 31: 75
5. Yang D, Conrad H. Scr Metall Mater, 1997; 36: 1431
6. Lu H A, Conrad H. Appl Phys Lett, 1991; 59(15): 1847
7. Liu W, Liang K M, Zheng Y K. J Mater Sci Lett, 1996; 15: 1918
8. Cao W D, Lu X P, Sprecher A F, Conrad H. Mater Lett, 1990; 9: 193
9. Conrad H, Guo Z, Spr A F. Scr Metall Mater, 1989; 23: 821
10. Schulz L G. J Appl Phys, 1949; 20: 1030
11. Liang Z D, Xu J Z, Xu, Wang F. Proc ICOTOM6, Tokyo, ISIJ, 1981: 1259
12. Vatne H E, Nes E. Scr Metall Mater, 1994; 30: 309
13. Balluffi R W. Grain Boundary Structure and Kinetics. Milwoukee, Am Soc Metals, 1979: 125
14. Daaland O, Nes E. Acta Metall, 1996; 44: 1413
15. Nes E. Z Metallkd, 1996; 87: 448
16. Samajdar I, Doherty R D. Scr Metall Mater, 1995; 32: 845