Room temperature curing epoxy adhesives for elevated temperature service†

The Journal of Adhesion

Volumn 22, Issue 3, 1987, Pages 227-251

  Dodiuk, H ^a   Kenig, S ^a   Liran, I ^a  

^a MOD ^*  (Israel)

Author keywords

DSC; epoxy; ing; mechanical properties; morphology; room temperature cur ; rubber toughening

Indexed keywords

EID: 0012669208     PISSN: 00218464     EISSN: 15455823     Source Type: Journal    
DOI: 10.1080/00218468708071245     Document Type: Article

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