Breakup and grain growth in thin-film array

Journal of Applied Physics

Volumn 81, Issue 1, 1997, Pages 238-245

  Vilenkin, A J ^a   Kris, R ^a   Brokman, A ^a,b  

^a HEBREW UNIVERSITY OF JERUSALEM   (Israel)

^b UNIVERSITY OF OXFORD   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0012652338     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.363988     Document Type: Article

References (10)

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4. W. W. Mullins, Acta Metall. Mater. 6, 414 (1958).
5. W. W. Mullins, J. Appl. Phys. 27, 900 (1956).
6. J. von Neumann, in Metal Interfaces (Am. Soc. for Testing Mater., Cleveland, OH, 1952).
7. W. W. Mullins, J. Appl. Phys. 28, 333 (1957).
8. V. E. Fradkov, D. Udler, Adv. Phys. 43, 739 (1994).
9. E. Jiran and C. V. Thompson, Thin Solid Films 208, 23 (1992).
10. A. J. Vilenkin, R. Kris, and A. Brokman (unpublished).