Thin Film Transfer Process for Low Cost MCM-D Fabrication

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 18, Issue 1, 1995, Pages 42-46

  Narayan, C ^a   Purushothaman, S ^a   Doany, F ^a   Deutsch, A ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

flexible man ; low cost; MCM; thin film transfer; ufacturing

Indexed keywords

CERAMIC MATERIALS; COSTS; ELECTRIC WIRING; ELECTRONICS PACKAGING; FLEXIBLE MANUFACTURING SYSTEMS; GLASS; MICROELECTRONICS; PRINTED CIRCUIT BOARDS; SEMICONDUCTING FILMS; SEMICONDUCTING SILICON; SUBSTRATES;

LOW COST FABRICATION; MICROELECTRONIC PACKAGES; PRINTED WIRING BOARDS; THIN FILM DECAL; THIN FILM STACK; THIN FILM TRANSFER;

MULTICHIP MODULES;

EID: 0012354984     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.365481     Document Type: Article

References (7)

1. N. J. Naclerio, “ARPA packaging strategy,” presented at the Int. Conf. MCM’s, Denver, CO, 1993.
2. W. Barker, “ARPA packaging strategy,” presented at ARPA/EIA/SEMI Workshop, Austin, TX, 1993.
3. G. Arjavalingam, A. Deutsch, B. K. Furman, D. J. Hunt, C. Narayan, M. M. Oprysko, S. Purushothaman, V. Ranieri, S. Renick, J. M. Shaw, J. S. Wilczynski, and D. F. Witman, “Multilayer thin film structure and parallel processing method for fabricating the same,” U.S. Patent No. 5 258 236, November 2, 1993.
4. C. Narayan and S. Purushothaman, “Thin film transfer process for low cost MCM’s,” in Proc 15th IEEE CHMT Electron. Manufact. Technol. Symp., Santa Clara, CA, 1993, pp. 373–380.
5. C. Narayan, B. K. Furman, F. Doany, and S. Purushothaman, IBM TJ Watson Research Center, Yorktown Hts., NY, 1991.
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