Micromechanical structures and microelectronics for acceleration sensing

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3223, Issue , 1997, Pages 237-244

  Davies, Brady R ^a   Montague, Stephen ^a   Smith, James H ^a   Lemkin, Mark ^a,b  

^a SANDIA NATIONAL LABORATORIES   (United States)

^b Actuator Center

Author keywords

Accelerometer; Capacitive sensors; Micromachined sensors

Indexed keywords

ACCELERATION SENSING; CAPACITIVE SENSORS; DESIGN TEAMS; ENABLING TECHNOLOGIES; FUTURE DEVELOPMENTS; G ACCELERATIONS; MASS SENSORS; MEMS ACCELEROMETERS; MICROMACHINED SENSORS; MICROMACHINED SILICONS; MICROMECHANICAL STRUCTURES; SANDIA NATIONAL LABORATORIES; TEST DATUMS; TEST RESULTS;

COMPOSITE MICROMECHANICS; DESIGN; ELECTROMECHANICAL DEVICES; MACHINING; MEMS; MICROANALYSIS; MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS; MICROFABRICATION; MICROMACHINING; PAPER; SENSORS;

ACCELEROMETERS;

EID: 0012350478     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.284486     Document Type: Conference Paper

References (4)

1. th Annual Symposium on Smart Structures and Materials, March, 1997.
2. J. Smith, S. Montague, J. J. Sniegowski, J. R. Murray, and P. J. McWhorter, "Embedded Micromechanical Devices for the Monolithic Integration of MEMS with CMOS," IEDM Tech. Digest, pp. 609-612, Dec. 1995.
3. T. B. Gabrielson, "Mechanical-Thermal Noise in Micromachined Acoustic and Vibration Sensors", IEEE Transactions on Electron Devices, Vol. 40, No. 5, May, 1993.
4. M. A. Lemkin, M. A. Ortiz, N. Wongkomet, B. E. Boser, J. Smith, "A 3-Axis Surface Micromachined SA Accelerometer", IEEE International Solid-State Circuits Conference, pp. 202-203, 1997.