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Volumn 70, Issue 11, 1991, Pages 7137-7140

A 3-dimensional model for low-pressure chemical-vapor-deposition step coverage in trenches and circular vias

Author keywords

[No Author keywords available]

Indexed keywords


EID: 0011709019     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.349797     Document Type: Article
Times cited : (72)

References (19)
  • 7
    • 84953818559 scopus 로고
    • Proceedings workshop on Tungsten and other Refractory Metals for VLSI Applications III, edited by V. A. Wells (Mater. Res. Soc., Pittsburgh, PA)
    • (1988) , pp. 257
    • McConica, C.M.1    Churchill, S.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.