Thick-film fabrication yields thin-film performance

Microwaves and RF

Volumn 39, Issue 2, 2000, Pages 97-100

  Dziurdzia, Barbara ^a   Ciez, Michal ^a   Nowak, Stanislaw ^b   Gregorczyk, Wojciech ^c   Thust, Heiko ^d   Polzer, Erich ^e  

^a Research and Development Center for Hybrid Microelectronics and Resistors   (Poland)

^b AGH UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Poland)

^c TELECOMMUNICATIONS RESEARCH INSTITUTE   (Poland)

^d ILMENAU UNIVERSITY OF TECHNOLOGY   (Germany)

^e DuPont de Nemours GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0011523037     PISSN: 07452993     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (6)

1. P. Barnwell, J. Wood, and Q. Reynolds, "A Microwave Circuit Fabrication Technology Using an Advanced Thick-film Materials System," Proc. EMIT98 - Second International Conference on Emerging Microelectronics and Interconnection Technologies, Bangalore, India, February 16-20, 1998, p. 399-104.
2. P. Barnwell and M.P. O'Neil, "Enabling Ceramic Circuit Technologies for Wireless Microelectronics Packaging," 1997 Wireless Communications Conference, Boulder CO, August 11-13, 1997, p. 156-161.
3. E. Kemppinen, P. Mikkonen, P. Collander, and S. Leppavuori, "Performance of Cu- and Ag-based Microstrips up to Millimetre Wave Frequencies," 11th European Microelectronics Conference, Venice, Italy, May 14-16, 1997, p. 100-108.
4. Data Sheets of DuPont and ESL (1997, 1998).
5. R. Keusseyan, B. Speck, J. Chaplinsky, D. Amey, D. Kuty, C. Needs, and S. Horowitz, "High Density Gold Thick-film Technology," International Symposium on Microelectronics, Philadelphia, October 14-16, 1997, p. 517-521.
6. B. Guillaume, J. Mabire, P. Maurin, D. Reffet, F. Chirol, and E. Polzer, "Microwave Applications Using Photo-Imageable Technology," Microwave Journal, March 1997, p. 102-106.