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Volumn 3046, Issue , 1997, Pages 230-241

Integration of LIGA Structures with CMOS Circuitry

Author keywords

CMOS circuits; Integration; Liga; Mems; Microelectromechanical systems

Indexed keywords

AUTOMOBILE MANUFACTURE; CAPACITIVE SENSORS; ELECTRODES; ELECTROMECHANICAL DEVICES; ETCHING; FABRICATION; INTEGRATION; MEMS; SILICON; SUBSTRATES; TIMING CIRCUITS;

EID: 0011211061     PISSN: 0277786X     EISSN: 1996756X     Source Type: Conference Proceeding    
DOI: 10.1117/12.276612     Document Type: Conference Paper
Times cited : (7)

References (24)
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    • E.W. Becher, W. Ehrfeld, P. Hagmann, A. Maner, D. Muenchmeyer, " Fabrication of microstructures with high aspect ratio and great structural heights by synchrotron radiation lithography, electroforming and plastic molding (LIGA process)", Microelectronic Engineering 4, pp. 35-56, 1986.
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.