A thermopneumatic micropump based on micro-engineering techniques

Micromechanics and MEMS: Classic and Seminal Papers to 1990

Volumn , Issue , 1997, Pages 450-454

  Van de pol, F C M ^a   Van Lintel, H T G ^a   Elwenspoek, M ^a   Fluitman, J H J ^a  

^a UNIVERSITY OF TWENTE   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0011022173     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1109/9780470545263.sect8     Document Type: Chapter

References (7)

1. J. G. Smits, Piezoelectric micropump with three valves working peristaltically, Sensors and Actuators, A21-A23 (1990) 203-206.
2. H. T. G. van Lintel, F. C. M. van de Pol and S. Bouwstra, A piezoelectric micropump based on micromachining of silicon, Sensors and Actuators, 15(1988) 153-167.
3. M. J. Zdeblick and J. B. Angell, A microminiature electric-to-fluidic valve, Proc. 4th Int. Conf. Solid-State Sensors and Actuators (Transducers’81), Tokyo, Japan, June 2-5, 1987, pp. 827-829.
4. F. C. M. van de Pol, D. G. J. Wonnink, M. Elwenspoek and J. H. J. Fluitman, A thermo-pneumatic actuation principle for a microminiature pump and other micromechanical devices, Sensors and Actuators, 17(1989) 139-143.
5. M. Bos and P. C. Breedveld, 1985 update of the bond graph bibliography, J. Franklin Inst., 319 (1985) 269-286.
6. A. Hanneborg and P. A. Øhlckers, Anodic bonding of silicon chips using sputter-deposited Pyrex 7740 thin films, Proc. 12th Nordic Semiconductor Meeting, Jevnaker, Norway, June 8-11, 1986, pp. 290-293.
7. G. Wallis and D. I. Pomerantz, Field assisted glass-metal sealing. J. Appl. Phys., 40(1969) 3946-3949.