A note on the evaluation of thermal constriction resistance for finite thickness gaps

Journal of Heat Transfer

Volumn 119, Issue 1, 1997, Pages 177-180

  Das, Ashok Kumar ^a   Sadha, Satwindar Singh ^b  

^a APPLIED MATERIALS INC   (United States)

^b University of Southern California ^*  (United States)

Author keywords

Conduction; Electronic; Equipment; Thermal packaging

Indexed keywords

EID: 0010753251     PISSN: 00221481     EISSN: 15288943     Source Type: Journal    
DOI: 10.1115/1.2824084     Document Type: Article

References (7)

1. Das, A. K., and Sadhal, S. S., 1991, “Thermal Constriction Resistance: The Effect of Interstitial Fluid,” Fundamentals of Conduction,' ASME HTD Vol. 173, pp. 35-39.
2. Das, A. K., and Sadhal, S. S., 1992, “Effect of Interstitial Fluid on Thermal Constriction Resistance,” ASME Journal of Heat Transfer, Vol. 114, No. 4, pp. 1045-1048.
3. Das, A. K., and Sadhal, S. S., 1995, “A Note on the Evaluation of Thermal Contact Resistance for Non-Zero Thickness Gaps,” ASME HTD Vol. 310, pp. 131-138.
4. Dundurs, J., and Panek, C., 1976, “Heat Conduction Between Bodies With Wavy Surfaces,” International Journal of Heat Mass Transfer, Vol. 19, No. 7, pp. 731-736.
5. Fenech, H., and Rohsenow, W. M., 1963, “Prediction of Thermal Conductance of Metallic Surfaces in Contact,” ASME Journal of Heat Transfer, February, pp. 15-24.
6. Song, S., Yovanovich, M. M., and Nho, K., 1992, “Thermal Gap Conductance: Effects of Gas Pressure and Mechanical Load,” Journal of Thermophysical Heat Transfer, Vol. 6, No. 1, pp. 62-68.
7. Veziroglu, T. N., and Chandra, S., 1968, “Thermal Conductance of Two-Dimensional Constrictions,” Progress in Astronautics and Aeronautics, Vol. 21: Thermal Design Principles of Spacecraft and Entry Bodies, pp. 591-615.