Transcription solder bump technology using the evaporation method

Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging

Volumn 1998-April, Issue , 1998, Pages 314-318

  Seyama, K ^a   Yamamoto, H ^a   Satou, K ^a   Yoshimura, H ^a   Ota, H ^a   Usui, Y ^a  

^a FUJITSU LABORATORIES LTD   (Japan)

Author keywords

evaporation; metal mask; solder Bump; transcription

Indexed keywords

CHIP SCALE PACKAGES; EVAPORATION; FLIP CHIP DEVICES; MICROPROCESSOR CHIPS; MULTICHIP MODULES; TRANSCRIPTION;

CURRENT PRODUCTION; DUMMY WAFERS; EVAPORATION METHOD; HIGH YIELD; HIGH-ACCURACY; METAL MASKS; RESTORATION TECHNIQUES; SOLDER BUMP;

SOLDERING;

EID: 0010729884     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICMCM.1998.670800     Document Type: Conference Paper

References (3)

1. Kaoru Hashimoto, Teru Nakanishi, Masayuki Ochiai, "Flip-Chip Connection Material for Packaging of VLSIs Operating in Liquid Nitrojen", Fujitsu Scientific and technical Journal Vo1.28 N0.3, September 1992
2. Ichiro Yamaguchi, Masahiko Yoshikawa, Koki Otake, Masataka Mizukoshi, Junichi Kasai, "Solder Bump Transcription Technology using a Dimple-plate Method", IMC 1996-OMTYA, April 1996
3. Stuart E. Greer, "An Extended Eutectic Solder Bump for FCOB", ECTC Proceedings, pp 546-551, May 1996