Low-cost reliable transfer mold sensor packaging concept

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3224, Issue , 1997, Pages 153-160

  Bossche, A ^a   Cotofana, C V B ^a   Kaldenberg, P ^b   Van Dommelen, I ^b   Mollinger, Jeff ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b Eurasem BV   (Netherlands)

Author keywords

Open window package; Plastic packaging; Sensor packaging

Indexed keywords

MOLDING; MOLDS; OPTICAL DEVICES; WINDOWS;

COMMERCIAL PRODUCTIONS; FRAME PROCESSING; LOW COSTS; MOLDING STEPS; OF SENSORS; OPEN WINDOW PACKAGE; PACKAGE STRUCTURES; PLASTIC PACKAGING; RELIABILITY TESTS; SENSOR PACKAGES; SENSOR PACKAGING;

SENSORS;

EID: 0010686460     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.284510     Document Type: Conference Paper

References (4)

1. Kaldenberg, K., "Development Report", EURASEM Internal Report, 1996/1997.
2. Pecht, Michael "Handbook of Electronic Package design", Dekker, New York, 1991.
3. Hacke, H.J.e.a.,"Micropack Packaging Technology", Siemens Forsch. Entwickl, pp. 227-229, 1988.
4. Pecht, Michael G./Nguyen, Luu T./ Hakim, Edward B., "Plastic -Encapsulated Microelectronics; materials, processes, quality, reliability, and applications" Wiley, New York, 1995.