Inductive crosstalk between integrated passive components in RF-wireless modules

Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging

Volumn 1998-April, Issue , 1998, Pages 496-500

  Frye, R C ^a   Smith, P R ^a   Low, Y L ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

Multichip module; passive components.; wireless

Indexed keywords

CELLULAR TELEPHONES; CROSSTALK; ELECTROMAGNETIC COUPLING; ELECTROMAGNETIC INDUCTION; GLOBAL SYSTEM FOR MOBILE COMMUNICATIONS; INTEGRATION; MICROPROCESSOR CHIPS; RADIO; RADIO TELEPHONE; RADIO TRANSCEIVERS; THIN FILM CIRCUITS; THIN FILMS;

COMPONENT INTEGRATION; GSM TRANSCEIVERS; INDUCTIVE COUPLINGS; INTEGRATED PASSIVE COMPONENTS; PASSIVE COMPONENTS; SILICON-ON-SILICON; SPIRAL INDUCTOR; TIGHT INTEGRATIONS;

MULTICHIP MODULES;

EID: 0010644066     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICMCM.1998.670830     Document Type: Conference Paper

References (9)

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