Techniques for rapid characterization of grinding wheel-workpiece combinations

Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture

Volumn 215, Issue 10, 2001, Pages 1385-1394

  Kompella, S ^a   Farris, T N ^a   Chandrasekar, S ^a  

^a SCHOOL OF INDUSTRIAL ENGINEERING   (United States)

Author keywords

Chip thickness; Grinding; Process evaluation; Residual stress; Temperature

Indexed keywords

EID: 0010322585     PISSN: 09544054     EISSN: None     Source Type: Journal    
DOI: 10.1243/0954405011519169     Document Type: Article

References (16)

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