Recent development of plasma pollution control technology: A critical review

Science and Technology of Advanced Materials

Volumn 2, Issue 3-4, 2001, Pages 571-576

  Chang, Jen Shih ^a  

^a MCMASTER UNIVERSITY   (Canada)

Author keywords

Greenhouse gas; Material processing flue gas; Non thermal plasma; ODS; PFCs; Pollution control; Thermal plasma; VOCs; Waste treatments; Water contamination

Indexed keywords

EID: 0010295434     PISSN: 14686996     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1468-6996(01)00139-5     Document Type: Article

References (15)

1. K. Urashima, J.S. Chang, Removal of volatile organic compounds from airstreams and industrial flue gases by non-thermal plasma technology, IEEE Trans. Dielectr. Elect. Insulat. 7 (2000) 602-614.
2. K.L.L. Vercamnen, A.A. Berezin, F. Lox, J.S. Chang, Destruction of volatile organic compounds by non-thermal plasma, J. Adv. Oxid. Tech. 2 (1997) 312-329.
3. J.S. Chang, Recent development of gaseous pollution control technologies based on non-thermal plasma, Oyobutsuri 69 (2000) 268-277 (Japanese).
4. J.S. Chang, Electromagnetic emissions from atmospheric pressure gas discharge, Trans. IEICE Jpn E79 (1996) 447-456.
5. J.S. Chang, Plasma Pollution control technology, Proc. First Asia-Pacific Int. Symp. Basic & Appl. Plasma Tech. (1997) 11-18.
6. J.S. Chang, R.P. Mohant, A status report on environmental applications of thermal plasma technology, Metallurgical Industry, The Metallurgical Society of CIM Press, Toronto, 1994, pp. 119-132.
7. P.H. Singer, Pre-pump scrubbers simplify maintenance and improve safety, Semicond. Int. March (1992) 1-3.
8. x in medium pressure process flue gas by plasma activation of nitrogen and ammonia, Proc. 11th Int. Symp. Plasma Chemistry, Quorn Selective Repro. Ltd, Loughborough, 1993, pp. 592-597.
9. 3 from semiconductor process flue gases by tandem packed bed plasma and adsorbent hybrid systems, IEEE Trans. Ind. Appl. Soc. 36 (2000) 1251-1259.
10. 6 from semiconductor process flue gas by packed bed plasma-adsorbent hybrid system, 1999 Conf. Rec. IEEE IAS Meet. 2 (1999) 1136-1143.
11. J.S. Chang, K. Urashima, K.G. Kostov, Y. Okayasu, T. Kato, T. Iwaizumi, K. Yoshimura, Non-thermal plasma mixed PFC treatments, Pacifichem Symposium on Plasma Chemistry and Technology for Green Manufacturing, Pollut. Ctrl Process. Appl., (2000) 1995 (abstract only).
12. H. Saito, A. Fukunaga, M. Ohsato, Treating exhaust gas from semi-conductor devicing system, Ebata Jiho 150 (1991) 82-92 (Japanese).
13. Y. Aoyagi, K. Shimamura, Thermal oxidation flue gas treatment system, Zosui Gijutsu 18 (1991) 1-5 (in Japanese).
14. E.J. Tonnis, J. Daniels, D. Graves, Point-of-use plasma abatement of PFCs: modelling and experiments, Bull. Am. Phys. Soc. 43 (1998) 1477 (abstract only).
15. 2 as an additive gas, Bull. Am. Phys. Soc. 43 (1998) 1475 (abstract only).