Passivation role of fluorine on the anticorrosion of AlCu films after plasma etching

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 16, Issue 3, 1998, Pages 1469-1472

  Baek, Kyu Ha ^a   Kim, Chang II ^b   Kwon, Kwang Ho ^c   Kim, Tae Hyung ^d   Chang, Eui Goo ^b   Yun, Sun Jin ^a   Yoon, Yong Sun ^a   Kim, Sang Gi ^a   Nam, Kee Soo ^a  

^a Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

^b Chung Ang University   (South Korea)

^c Hanseo University   (South Korea)

^d Yeojoo Technical College   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AL-CU ALLOYS; ANGLE-RESOLVED XPS; ANTI-CORROSION; CHAMBER PRESSURE; CU ETCHING; ETCHED SURFACE; GAS PLASMA; MOISTURE PENETRATION; PASSIVATION FILM; PASSIVATION LAYER; POST TREATMENT; RELATED COMPOUNDS; SEM; SEM IMAGE; X-RAY PHOTOELECTRON SPECTROSCOPY STUDIES;

ALLOYS; ALUMINUM; COPPER; CORROSION; FLUORINE; METALLIC FILMS; ORGANIC POLYMERS; PASSIVATION; PLASMA ETCHING; SCANNING ELECTRON MICROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY;

COPPER ALLOYS;

EID: 0009773749     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.581171     Document Type: Article

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