Effect of texture and testing conditions on strain localization during cyclic deformation of copper polycrystals

Materials Science and Engineering: A

Volumn 270, Issue 2, 1999, Pages 349-353

  Peralta, P ^a   Czapka, A ^b   Obergfell, K ^c   Lianes, L ^c   Laird, C ^b   Mitchell, T E ^d  

^a Arizona State University   (United States)

^b UNIVERSITY OF PENNSYLVANIA   (United States)

^c UNIVERSITAT POLITÈCNICA DE CATALUNYA   (Spain)

^d LOS ALAMOS NATIONAL LABORATORY   (United States)

Author keywords

Copper polycrystals; Fatigue tests; Stress strain curve

Indexed keywords

CRYSTAL ORIENTATION; CRYSTALLOGRAPHY; DEFORMATION; FATIGUE TESTING; GRAIN SIZE AND SHAPE; POLYCRYSTALS; STRAIN; STRESSES; TEXTURES; THERMOMECHANICAL TREATMENT;

CYCLIC STRESS STRAIN CURVE; STRAIN LOCALIZATION;

COPPER;

EID: 0009424562     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(99)00200-2     Document Type: Article

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