Microwave multichip module utilizing aluminum silicon carbide with in-situ cast components and high density interconnect technology

International Journal of Microcircuits and Electronic Packaging

Volumn 20, Issue 3, 1997, Pages 303-308

  Dufour, Bradley ^a,b,c,d   McNulty, Michael ^a,e   Miller, Stephen ^a,f,g  

^a Lockheed Martin Gov Electron Syst   (United States)

^b Lockheed Martin's Govt Electron S   (United States)

^c WORCESTER POLYTECHNIC INSTITUTE   (United States)

^d UNIVERSITY OF PENNSYLVANIA   (United States)

^e Lockheed Martin's Govt Electron S   (United States)

^f DREXEL UNIVERSITY   (United States)

^g IEEE

Author keywords

Aluminum Silicon Carbide; Electronic Packaging; High Density Interconnect; Microwave; Multichip Module

Indexed keywords

EID: 0009189940     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (8)

1. J. H. Lau, ed. Chip On Board Technologies For Multichip Modules, Van Nostrand Weinhold Publishers, New York, Chapter 1, pp. 25-27, 1994.
2. M. Gdula, et al., "A 36-Chip Multiprocessor Multichip Module made with the General Electric High Density Interconnect Technology," Proceedings of the IEEE, pp. 727-730, 1991.
3. J.D. Kennedy, et al., "GHz Packaging," Advanced Packaging, Vol. 5, No. 6, pp. 24-26, November/December, 1996.
4. J. L. Bugeau, et al., "Aluminum Silicon Carbide for High Performance Microwave Packages," Proceedings of the IEEE MTT-S, pp. 1575-1578, 1995.
5. Ceramics Process Systems Corporation, "AlSiC Microwave Packages," Microwave Journal, pp. 90-94, June 1996.
6. B. E. Novich, et al., "Design and Fabrication of Metal Matrix Composites for Microwave and Millimeter Wave Integrated Circuit Packages," Proceedings of The International Symposium on Microelectronics, ISHM '94 Proceedings, pp. 590-595, 1994.
7. Concurrent Integration™, QuickSet™, and QuickCast™ are all registered trademarks of Ceramics Process Systems.
8. R. Fillion, et al., "Non-Digital Extensions of an Embedded Chip MCM Technology," Proceedings of 1994 Multichip Module Conference (MCM), Denver, Colorado, pp. 464-473, 1994.