Microstructure mapping of interconnects by orientation imaging microscopy

Journal of Electronic Materials

Volumn 25, Issue 11, 1996, Pages 1767-1771

  Field, David P ^a   Dingley, David J ^a,b  

^a TexSEM Laboratories Inc   (United States)

^b UNIVERSITY OF BRISTOL   (United Kingdom)

Author keywords

Interconnect lines; Metallization; Orientation imaging microsocpy (OIM); Scanning electron microscopy (SEM)

Indexed keywords

EID: 0009038362     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-996-0033-0     Document Type: Article

References (18)

1. M.N. Alam, M. Blackman and D.W. Pashley, Proc. R. Soc. 221A, 224 (1954).
2. J.A. Venables, and C.J. Harland, Phil. Mag. 27, 1193 (1973).
3. D. J. Dingley and K.Z. Baba Kishi, Scanning Electron Microscopy II, 383 (1986).
4. B.L. Adams, S.I. Wright and K. Kunze, Metall. Trans. 24A, 819 (1993).
5. S.I. Wright, J. Computer-Assisted Microscopy 5, 207 (1993).
6. S.I. Wright, B.L. Adams and K. Kunze, Matls. Sci. Eng. A166, 59 (1993).
7. J.L. Kurd, K.P. Rodbell, D.B. Knorr and N.L. Koligman, Mater. Res. Soc. Symp. Proc. 343, (Pittsburgh, PA: Mater. Res. Soc., 1994), p. 653.
8. J.E. Sanchez, Jr., V. Randle, O. Kraft and E. Arzt, SPIE Proc. 1805, (SPIE, 1993), p. 222.
9. S. Kordic, R.A.M. Wolters and K.Z. Troost, J. Appl. Phys. 74, 5391 (1993).
10. O.P. Field and D.J. Dingley, Solid State Techn. 38, (11), 91 (1995).
11. O.P. Field, D.J. Dingley, M.M. Nowell and B.L. Adams, ISTFA 21 Proc. (1995), p. 49.
12. D.B. Knorr, Mater. Res. Soc. Symp. 309, (Pittsburgh, PA: Mater. Res. Soc., 1993), p. 75.
13. W.D. Nix, Met. Trans. 20A, 2217 (1989).
14. J.E. Sanchez, Jr. and E. Arzt, Scripta metall. et mater. 27, 285 (1992).
15. Y.-C. Joo and C.V. Thompson, J. Appl. Phys. 76, 7339 (1994).
16. D. Gerth and R.A. Schwarzer, Mater. Sci. Forum 113-115, 625 (1992).
17. J.K. MacKenzie, Biometrika 45, 229 (1958).
18. V. Randle, Microtexture Determination and its Applications, (London: Institute of Materials, 1992).