Improving rinse efficiency with automated cleaning tools: Optimizing chemical residue removal steps in a wafer wet clean sequence increases semiconductor yields and cuts resource costs

Semiconductor International

Volumn 19, Issue 12, 1996, Pages 151-160

  Hall, R M ^a   Rosato, J J ^a   Lindquist, P G ^a   Jarvis, T ^a   Parry, T ^a   Walters, R N ^a  

^a Akrion   (United States)

Author keywords

Contamination control; Surface physics; Wafer cleaning

Indexed keywords

EID: 0008908691     PISSN: 01633767     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)

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3. G.D. Ching and R.B. Murtha, "Comparing Cost of Ownership for 200- and 150-mm Immersion Wet Cleaning Equipment," Microcontamination, January 1994, pp. 29-32, 71.
4. C.T. Sorenson, "Still Water Runs Deep," Semi/Sematech News, No. 27, December 1993.
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6. S.N. Kempka et. al., "Evaluation of Overflow Wet Rinsing Efficiency," Proceedings: Microcontamination 94, pp. 225-234.
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8. A. Tonti, Proceedings of The Second International Symposium on Cleaning Technology in Semiconductor Device Manufacturing, J. Ruzyllo and R Novack (Eds), PV92-12, pp. 41-47.
9. H. Schlichting, Boundary Layer Theory, McGraw-Hill, New York (1968).
10. R.M. Hall et. al., "Optimization of SC1-Megasonic Cleaning Efficiency for 200 mm Wafer Processing," Proceedings: Microcontamination 94, pp. 529-537.
11. P..J. Resnick et al., Proceedings of The Third International Symposium on Cleaning Technology in Semiconductor Device Manufacturing, J. Ruzyllo and R. Novack (Eds), PV94-7, pp. 450-457.
12. D. Zhang, "An Investigation of Large Scale Acoustic Streaming in Megasonic Cleaning," Proceedings: Microcontamination 94, pp. 215-224.